Invention Grant
- Patent Title: Optical interconnect
- Patent Title (中): 光互连
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Application No.: US11811506Application Date: 2007-06-11
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Publication No.: US08009992B2Publication Date: 2011-08-30
- Inventor: R. Stanley Williams
- Applicant: R. Stanley Williams
- Applicant Address: US TX Houston
- Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee Address: US TX Houston
- Main IPC: H04B10/00
- IPC: H04B10/00

Abstract:
An optical interconnect includes a translatable optical source; an optical modulator element disposed on a circuit board and configured to receive an optical beam from the optical source; and an optical receiver disposed on a circuit board and configured to receive a modulated optical beam from the modulator element.
Public/Granted literature
- US20080304832A1 Optical interconnect Public/Granted day:2008-12-11
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