Invention Grant
- Patent Title: Singulation handler system for electronic packages
- Patent Title (中): 电子封装的分割处理系统
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Application No.: US11925091Application Date: 2007-10-26
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Publication No.: US08011058B2Publication Date: 2011-09-06
- Inventor: Chi Wah Cheng , Wang Lung Alan Tse , Tim Wai Tony Mak , Ming Cheong Kary Tse
- Applicant: Chi Wah Cheng , Wang Lung Alan Tse , Tim Wai Tony Mak , Ming Cheong Kary Tse
- Applicant Address: HK Hong Kong
- Assignee: ASM Assembly Automation Ltd
- Current Assignee: ASM Assembly Automation Ltd
- Current Assignee Address: HK Hong Kong
- Agency: Ostrolenk Faber LLP
- Main IPC: A47L5/38
- IPC: A47L5/38

Abstract:
A singulation handler system is provided for a strip of electronic packages, which comprises an onloader located adjacent to an onloading location for providing an unsingulated strip of packages for singulation and a cutting jig for mounting the strip of unsingulated packages. The cutting jig is movable between the onloading location and a singulation location at which the strip is singulated by a singulation engine. The system further includes a buffer boat for holding singulated packages that have been removed from the cutting jig and which is operative to convey the singulated packages in a fixed relative orientation. A gang pick head is operative to transfer multiple singulated packages simultaneously from the buffer boat to a rotary turret device and an offloader is provided for transferring singulated packages from the rotary turret device to containers in which the singulated packages are storable.
Public/Granted literature
- US20080101894A1 SINGULATION HANDLER SYSTEM FOR ELECTRONIC PACKAGES Public/Granted day:2008-05-01
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