Invention Grant
- Patent Title: Method for manufacture of piezoelectric substrate for a saw device
- Patent Title (中): 锯装置用压电基板的制造方法
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Application No.: US12014191Application Date: 2008-01-15
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Publication No.: US08011074B2Publication Date: 2011-09-06
- Inventor: Kushal Bhattacharjee , Sergei Zhgoon
- Applicant: Kushal Bhattacharjee , Sergei Zhgoon
- Applicant Address: US NC Greensboro
- Assignee: RF Micro Devices, Inc.
- Current Assignee: RF Micro Devices, Inc.
- Current Assignee Address: US NC Greensboro
- Agency: Withrow & Terranova, P.L.L.C.
- Main IPC: H01L41/22
- IPC: H01L41/22 ; H04R17/00

Abstract:
The present invention provides a composite structure having a supporting substrate between a piezoelectric substrate and a compensation layer. The materials used to form the piezoelectric substrate and the compensation layer in isolation, have higher thermal coefficients of expansion (TCE) relative to the TCE of the materials forming the supporting substrate. Once the composite structure is created, the piezoelectric substrate and compensation layer tend to expand and contract in a similar manner as temperature changes. The expansion and contraction forces applied to the supporting substrate by the piezoelectric substrate due to temperature changes are substantially countered by similar opposing forces applied by the compensation layer, resulting in the opposing forces substantially counteracting one another. Due to the counteraction, the composite structure resists bending or warping, reducing expansion and contraction and increasing stress of the piezoelectric substrate, and thus reducing the effective TCE and TCF of the piezoelectric substrate.
Public/Granted literature
- US20080168638A1 PIEZOELECTRIC SUBSTRATE FOR A SAW DEVICE Public/Granted day:2008-07-17
Information query
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