A package carrier enclosing at least one microelectronic element has a pattern of electrically conductive connection pads for electric connection of the package to another device. The package carrier is manufactured by providing a sacrificial carrier; applying an electrically conductive pattern to one side of the carrier; bending the carrier to create a shape having an elevated portion and recessed portions; forming a body member on the carrier at the side where the electrically conductive pattern is present; removing the sacrificial carrier; and placing a microelectronic element in a recess created in the body member at the position where the elevated portion of the carrier has been, and connecting the microelectronic element to the electrically conductive pattern. Furthermore, a hole in the package provides access to a sensitive surface of the microelectronic element.