Invention Grant
- Patent Title: Method for fabricating clamping device for flexible substrate
- Patent Title (中): 柔性基板夹紧装置的制造方法
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Application No.: US12542123Application Date: 2009-08-17
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Publication No.: US08011085B2Publication Date: 2011-09-06
- Inventor: Chin-Jyi Wu , Chen-Der Tsai , Yun-Chuan Tu , Te-Chi Wong
- Applicant: Chin-Jyi Wu , Chen-Der Tsai , Yun-Chuan Tu , Te-Chi Wong
- Applicant Address: TW Hsinchu
- Assignee: Industrial Technology Research Institute
- Current Assignee: Industrial Technology Research Institute
- Current Assignee Address: TW Hsinchu
- Agency: J.C. Patents
- Priority: TW94141429A 20051125
- Main IPC: B23P19/00
- IPC: B23P19/00 ; B23Q1/00
Abstract:
A method of fabricating a clamping device for a flexible substrate is provided. A carrier board is provided. A plurality of holes is formed in the carrier board. A fixed positioning assembly and a movable positioning assembly are respectively embedded in the plurality of holes.
Public/Granted literature
- US20090300898A1 CLAMPING DEVICE FOR FLEXIBLE SUBSTRATE AND METHOD FOR FABRICATING THE SAME Public/Granted day:2009-12-10
Information query
