Invention Grant
- Patent Title: Method of repairing segmented contactor
- Patent Title (中): 修复分段接触器的方法
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Application No.: US12546924Application Date: 2009-08-25
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Publication No.: US08011089B2Publication Date: 2011-09-06
- Inventor: Mohammad Eslamy , David V. Pedersen , Harry D. Cobb
- Applicant: Mohammad Eslamy , David V. Pedersen , Harry D. Cobb
- Applicant Address: US CA Livermore
- Assignee: FormFactor, Inc.
- Current Assignee: FormFactor, Inc.
- Current Assignee Address: US CA Livermore
- Agency: Kirton & McConkie
- Main IPC: H01R9/00
- IPC: H01R9/00

Abstract:
A method of fabricating a large area, multi-element contactor. A segmented contactor is provided for testing semiconductor devices on a wafer that comprises a plurality of contactor units mounted to a substrate. The contactor units are formed, tested, and assembled to a backing substrate. The contactor units may include leads extending laterally for connection to an external instrument such as a burn-in board. The contactor units include conductive areas such as pads that are placed into contact with conductive terminals on devices under test.
Public/Granted literature
- US20100043226A1 SEGMENTED CONTACTOR Public/Granted day:2010-02-25
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