Invention Grant
- Patent Title: Method of manufacturing connectors
- Patent Title (中): 制造连接器的方法
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Application No.: US11289734Application Date: 2005-11-29
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Publication No.: US08011093B2Publication Date: 2011-09-06
- Inventor: Yoshio Nakamura
- Applicant: Yoshio Nakamura
- Applicant Address: JP Kanagawa-ken
- Assignee: Tyco Electronics Japan G.K.
- Current Assignee: Tyco Electronics Japan G.K.
- Current Assignee Address: JP Kanagawa-ken
- Agency: Barley Snyder LLC
- Priority: JP2004-348062 20041201
- Main IPC: H01R43/00
- IPC: H01R43/00

Abstract:
A method for manufacturing connectors comprises providing a carrier strip with a plurality of first alignment apertures and a plurality of contacts arranged in a row. The carrier strip is cut to desired lengths to form contact band pieces. The first alignment apertures are engaged with first protrusions on a carrier tape to mount each of the contact band pieces to the carrier tape. The first protrusions have a smaller outer diameter than an inner diameter of the first alignment apertures such that there is slight play there between. Resin is insert molded around the rows of the contacts to form a housing. The contacts are then cut from the carrier strip.
Public/Granted literature
- US20060112547A1 Method of manufacturing connectors Public/Granted day:2006-06-01
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