A transparent measuring apparatus for material includes a planar structure including a top surface, bottom surface, a left edge, a right edge, a top end, a bottom end and a plurality of holes for attachment of accessories. A plurality of measurement lines is formed on at least one of the top and bottom surfaces. A material alignment guide is attached to the bottom surface. The material alignment guide includes a first edge for aligning the material and is configured for moveably aligning the first edge with the measurement lines. Protrusions extend below the bottom surface a sufficient distance from the bottom surface to facilitate movement of the material alignment device. A plurality of accessories adds width to the planer structure, adds length to the planer structure, provides a safety barrier when cutting along an edge and provides a slot for guiding cutting along an edge of the planer structure.