Invention Grant
US08011116B2 Substrate proximity drying using in-situ local heating of substrate
失效
使用原位局部加热底物的基片接近干燥
- Patent Title: Substrate proximity drying using in-situ local heating of substrate
- Patent Title (中): 使用原位局部加热底物的基片接近干燥
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Application No.: US12860786Application Date: 2010-08-20
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Publication No.: US08011116B2Publication Date: 2011-09-06
- Inventor: Katrina Mikhaylichenko , Kenneth C. Dodge , Mikhail Korolik , Michael Ravkin , John M. de Larios , Fritz C. Redeker
- Applicant: Katrina Mikhaylichenko , Kenneth C. Dodge , Mikhail Korolik , Michael Ravkin , John M. de Larios , Fritz C. Redeker
- Applicant Address: US CA Fremont
- Assignee: Lam Research Corporation
- Current Assignee: Lam Research Corporation
- Current Assignee Address: US CA Fremont
- Agency: Martine Penilla & Gencarella, LLP
- Main IPC: F26B3/34
- IPC: F26B3/34
Abstract:
A method is provided for removing a residual fluid remaining at a point of contact between a substrate support member and a back surface of a substrate being prepared by a proximity head. According to the method, the proximity head is applied onto the back surface of the substrate and the substrate support member being held by a carrier. The substrate support member is heated after the substrate support member passes the proximity head. The heating of the substrate support member is discontinued once the residual fluid has substantially evaporated.
Public/Granted literature
- US20100313443A1 SUBSTRATE PROXIMITY DRYING USING IN-SITU LOCAL HEATING OF SUBSTRATE Public/Granted day:2010-12-16
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