Invention Grant
US08011253B2 Stress-wave sensor module, stress-wave sensor, and method for detecting a vehicle collision event utilizing the stress-wave sensor
有权
应力波传感器模块,应力波传感器和利用应力波传感器检测车辆碰撞事件的方法
- Patent Title: Stress-wave sensor module, stress-wave sensor, and method for detecting a vehicle collision event utilizing the stress-wave sensor
- Patent Title (中): 应力波传感器模块,应力波传感器和利用应力波传感器检测车辆碰撞事件的方法
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Application No.: US12484547Application Date: 2009-06-15
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Publication No.: US08011253B2Publication Date: 2011-09-06
- Inventor: Daniel Woon Leong , Chee Keng Yeo , Yew Kwang Low , Kok Wee Yeo
- Applicant: Daniel Woon Leong , Chee Keng Yeo , Yew Kwang Low , Kok Wee Yeo
- Applicant Address: US MI Troy
- Assignee: Delphi Technologies, Inc.
- Current Assignee: Delphi Technologies, Inc.
- Current Assignee Address: US MI Troy
- Agent Thomas N. Twomey
- Main IPC: G01B7/16
- IPC: G01B7/16

Abstract:
A stress-wave sensor module, a stress-wave sensor, and a method for detecting a vehicle collision event utilizing the stress-wave sensor are provided. The stress-wave sensor has first and second support members and a diaphragm member coupled between the first and second support members. The stress-wave sensor further has first and second strain gauge sensors coupled to both the first support member and the diaphragm member. The first and second strain gauge sensors generate first and second signals, respectively, in response to the first and second strain gauge sensors detecting deflection of the diaphragm member due to stress waves propagating through the diaphragm member.
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