Invention Grant
- Patent Title: Thin film forming apparatus
- Patent Title (中): 薄膜成型装置
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Application No.: US10588507Application Date: 2005-02-10
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Publication No.: US08011315B2Publication Date: 2011-09-06
- Inventor: Takafumi Matsumoto , Shun Mikami , Kouichi Hanzawa , Mineharu Moriya , Hideyuki Odagi , Tetsuya Shimada , Masashi Kubo , Susumu Ikeda
- Applicant: Takafumi Matsumoto , Shun Mikami , Kouichi Hanzawa , Mineharu Moriya , Hideyuki Odagi , Tetsuya Shimada , Masashi Kubo , Susumu Ikeda
- Applicant Address: JP Kanagawa
- Assignee: ULVAC, Inc.
- Current Assignee: ULVAC, Inc.
- Current Assignee Address: JP Kanagawa
- Agency: Arent Fox LLP
- Priority: JP2004-033501 20040210
- International Application: PCT/JP2005/002050 WO 20050210
- International Announcement: WO2005/075701 WO 20050818
- Main IPC: B05C11/02
- IPC: B05C11/02

Abstract:
A thin film forming apparatus such that a substrate can be easily fixed/removed to/from the outer circumferential surface of a drum type substrate holder through a simple arrangement.The drum type substrate holder (5) is supported in a horizontal posture rotatably about a horizontal rotational shaft in a film deposition chamber A jig (13) holding a substrate (12) fixedly is transferred by an arm horizontally onto the outer circumferential surface of the drum type substrate holder (5), and an end part (13b) of the substrate fixing jig (13) can be secured by a securing device (14) provided at the corner part (5a) of the outer circumferential surface of the drum type substrate holder (5).
Public/Granted literature
- US20080141943A1 Thin Film Forming Apparatus Public/Granted day:2008-06-19
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