Invention Grant
US08011561B2 Method of mounting electronic components on printed circuit boards
失效
将电子元件安装在印刷电路板上的方法
- Patent Title: Method of mounting electronic components on printed circuit boards
- Patent Title (中): 将电子元件安装在印刷电路板上的方法
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Application No.: US12753128Application Date: 2010-04-02
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Publication No.: US08011561B2Publication Date: 2011-09-06
- Inventor: Ji Ma , Li-Bing Lu , Hui Luo , Qi Huang
- Applicant: Ji Ma , Li-Bing Lu , Hui Luo , Qi Huang
- Applicant Address: CN Shenzhen, Guangdong Province TW Tu-Cheng, New Taipei
- Assignee: Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd.,Hon Hai Precision Industry Co., Ltd.
- Current Assignee: Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd.,Hon Hai Precision Industry Co., Ltd.
- Current Assignee Address: CN Shenzhen, Guangdong Province TW Tu-Cheng, New Taipei
- Agency: Altis Law Group, Inc.
- Priority: CN201010300241 20100113
- Main IPC: B23K31/02
- IPC: B23K31/02

Abstract:
A method of mounting electronic components on a PCB, includes following steps. The PCB is placed with a first side of the PCB facing upwards. A plurality of solder is applied on bonding pads of the first side. A plurality of electronic components is stuck on the bonding pads of the first side. The PCB is turned over with a second side of the PCB facing upwards and the first side of the PCB facing downwards. A plurality of solder is applied on bonding pads of the second side. A plurality of electronic components is stuck on the bonding pads of the second side. The PCB is placed in a reflow oven to weld the electronic components on the first side and the second side of the PCB.
Public/Granted literature
- US20110167627A1 METHOD OF MOUNTING ELECTRONIC COMPONENTS ON PRINTED CIRCUIT BOARDS Public/Granted day:2011-07-14
Information query
IPC分类: