Invention Grant
US08011561B2 Method of mounting electronic components on printed circuit boards 失效
将电子元件安装在印刷电路板上的方法

Method of mounting electronic components on printed circuit boards
Abstract:
A method of mounting electronic components on a PCB, includes following steps. The PCB is placed with a first side of the PCB facing upwards. A plurality of solder is applied on bonding pads of the first side. A plurality of electronic components is stuck on the bonding pads of the first side. The PCB is turned over with a second side of the PCB facing upwards and the first side of the PCB facing downwards. A plurality of solder is applied on bonding pads of the second side. A plurality of electronic components is stuck on the bonding pads of the second side. The PCB is placed in a reflow oven to weld the electronic components on the first side and the second side of the PCB.
Public/Granted literature
Information query
Patent Agency Ranking
0/0