Invention Grant
US08011749B2 Apparatus and method for measuring thickness of ink layer in pixel
有权
用于测量像素中油墨层厚度的装置和方法
- Patent Title: Apparatus and method for measuring thickness of ink layer in pixel
- Patent Title (中): 用于测量像素中油墨层厚度的装置和方法
-
Application No.: US12123713Application Date: 2008-05-20
-
Publication No.: US08011749B2Publication Date: 2011-09-06
- Inventor: Sang-il Kim , Tae-gyun Kim , Tae-woon Cha , Sang-kwon Wee
- Applicant: Sang-il Kim , Tae-gyun Kim , Tae-woon Cha , Sang-kwon Wee
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG Electronics Co., Ltd.
- Current Assignee: SAMSUNG Electronics Co., Ltd.
- Current Assignee Address: KR Suwon-si
- Agency: Stanzione & Kim, LLP
- Priority: KR10-2008-0002641 20080109
- Main IPC: B41J29/38
- IPC: B41J29/38 ; B41J29/393 ; G01F23/00

Abstract:
Provided are an apparatus and method for measuring the thickness of an ink layer in a pixel and a method of controlling nozzles of an inkjet head using the apparatus and method. The apparatus includes: a substrate; a plurality of pixels disposed on the substrate and filled with ink due to a printing operation; first and second electrodes corresponding to the pixels, the first and second electrodes disposed on opposite sides of each of the pixels; and a capacitance measurement circuit electrically connected to the first and second electrodes to measure the capacitance of each of the pixels.
Public/Granted literature
- US20090174742A1 APPARATUS AND METHOD FOR MEASURING THICKNESS OF INK LAYER IN PIXEL Public/Granted day:2009-07-09
Information query
IPC分类: