Invention Grant
US08011809B2 Light-emitting diode module with heat dissipating structure and lamp with light-emitting diode module
失效
具有散热结构的发光二极管模块和带有发光二极管模块的灯
- Patent Title: Light-emitting diode module with heat dissipating structure and lamp with light-emitting diode module
- Patent Title (中): 具有散热结构的发光二极管模块和带有发光二极管模块的灯
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Application No.: US12466427Application Date: 2009-05-15
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Publication No.: US08011809B2Publication Date: 2011-09-06
- Inventor: Yun Chang Liao
- Applicant: Yun Chang Liao
- Agency: Kamrath & Associates PA
- Agent Alan Kamrath
- Priority: TW97118242A 20080516; TW98202426U 20090219
- Main IPC: F21V29/00
- IPC: F21V29/00

Abstract:
A lamp (6) includes a housing (5) mounted to a lamp post (4) and a light-emitting diode module (10) mounted in the housing (5). The light-emitting diode module (10) includes a metal substrate (21) and a plurality of light-emitting diode dies (221) mounted on a face (211) of the metal substrate (21). A jacket (11) has a coupling surface (112) engaged with the other face (212) of the metal substrate (21). A heat conduction pipe (12) includes a portion (123) received in a longitudinal hole (111) of the jacket (11). The coupling surface (112) of the jacket (11) has an opening (114) in communication with the longitudinal hole (111). A portion of an outer periphery (124) of the portion (123) of the heat conduction pipe (12) is in direct, thermal contact with the other face (212) of the metal substrate (21) through the opening (114) of the jacket (11) to absorb heat generated by the light-emitting diode dies (221). A finned heat sink (13) is mounted on another portion (121) of the heat conduction pipe (12) outside the jacket (11) to dissipate heat transferred to the heat conduction pipe (12) into the environment.
Public/Granted literature
- US20090284972A1 Light-emitting Diode Module with Heat Dissipating Structure and Lamp with Light-emitting Diode Module Public/Granted day:2009-11-19
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