Invention Grant
- Patent Title: Mold, imprint apparatus, and process for producing structure
- Patent Title (中): 模具，压印设备和生产结构的过程
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Application No.: US11468870Application Date: 2006-08-31
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Publication No.: US08011916B2Publication Date: 2011-09-06
- Inventor: Nobuhito Suehira , Junichi Seki
- Applicant: Nobuhito Suehira , Junichi Seki
- Applicant Address: JP Tokyo
- Assignee: Canon Kabushiki Kaisha
- Current Assignee: Canon Kabushiki Kaisha
- Current Assignee Address: JP Tokyo
- Agency: Fitzpatrick, Cella, Harper & Scinto
- Priority: JP2005/257431 20050906
- Main IPC: B29C59/00
- IPC: B29C59/00 ; B29C35/08
Abstract:
In order to alleviate or suppress curing of a photocurable resin material in an area in which the curing of the photocurable resin material is not intended, exposure of the photocurable resin material to light is suppressed through a non-pattern portion at which a light-blocking member is provided by means of a mold having an imprint pattern portion and the non-pattern portion or is suppressed by disposing a light-blocking member so as not to irradiate the photocurable resin material with light not via the mold.
Public/Granted literature
- US20070054097A1 MOLD, IMPRINT APPARATUS, AND PROCESS FOR PRODUCING STRUCTURE Public/Granted day:2007-03-08
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