Invention Grant
- Patent Title: Compression molding of an electronic device
- Patent Title (中): 电子设备的压缩成型
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Application No.: US11746291Application Date: 2007-05-09
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Publication No.: US08011917B2Publication Date: 2011-09-06
- Inventor: Ji Yuan Hao , See Yap Ong , Jian Xiong Su , Teng Hock Kuah , Ee Ling Chiw
- Applicant: Ji Yuan Hao , See Yap Ong , Jian Xiong Su , Teng Hock Kuah , Ee Ling Chiw
- Applicant Address: SG Singapore
- Assignee: ASM Technology Singapore Pte Ltd
- Current Assignee: ASM Technology Singapore Pte Ltd
- Current Assignee Address: SG Singapore
- Agency: Ostrolenk Faber LLP
- Main IPC: H01L21/56
- IPC: H01L21/56 ; A01J21/00
Abstract:
A compression molding system comprising first and second mold halves is provided for an electronic device wherein a plurality of cavities are formed in the first mold half corresponding to molding locations on the electronic device. A plurality of plungers are located in the first mold half, each of which is drivable against a side of a respective cavity for applying a compacting force to encapsulation material located in the cavity during molding. A motor is operatively connected to the plungers for driving the plungers relative to the cavities.
Public/Granted literature
- US20080277829A1 COMPRESSION MOLDING OF AN ELECTRONIC DEVICE Public/Granted day:2008-11-13
Information query
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