Invention Grant
US08011933B2 Substrate connecting connector and semiconductor device socket, cable connector, and board-to-board connector having substrate connecting connector
失效
基板连接连接器和半导体器件插座，电缆连接器和具有基板连接连接器的板对板连接器
- Patent Title: Substrate connecting connector and semiconductor device socket, cable connector, and board-to-board connector having substrate connecting connector
- Patent Title (中): 基板连接连接器和半导体器件插座，电缆连接器和具有基板连接连接器的板对板连接器
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Application No.: US12751715Application Date: 2010-03-31
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Publication No.: US08011933B2Publication Date: 2011-09-06
- Inventor: Toshiyasu Ito
- Applicant: Toshiyasu Ito
- Applicant Address: JP Tokyo
- Assignee: Yamaichi Electronics Co., Ltd.
- Current Assignee: Yamaichi Electronics Co., Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Finnegan, Henderson, Farabow, Garrett & Dunner, LLP
- Priority: JP2009-124485 20090522
- Main IPC: H01R12/00
- IPC: H01R12/00
Abstract:
An electrode terminal supporting body fixed on a printed wiring board and an anisotropic conductive sheet which is positioned on the electrode terminal supporting body and on which a semiconductor device is placed are provided between first and second stiffening plates. The first and second stiffening plates are fastened by machine screws with the electrode terminal supporting body, the anisotropic conductive sheet, and the printed wiring board interposed therebetween.
Public/Granted literature
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