Invention Grant
- Patent Title: High frequency micro connector
- Patent Title (中): 高频微型连接器
-
Application No.: US12853416Application Date: 2010-08-10
-
Publication No.: US08011959B1Publication Date: 2011-09-06
- Inventor: Cheng-Yung Tsai , Ming-Yung Chang
- Applicant: Cheng-Yung Tsai , Ming-Yung Chang
- Applicant Address: TW Hsin-Tien
- Assignee: Advanced Connectek Inc.
- Current Assignee: Advanced Connectek Inc.
- Current Assignee Address: TW Hsin-Tien
- Agency: Bacon & Thomas, PLLC
- Priority: TW99209383U 20100519
- Main IPC: H01R25/00
- IPC: H01R25/00

Abstract:
A high frequency micro connector has an insulating housing, multiple first terminals and multiple terminals. The insulating housing has a base, a first tongue and a second tongue. The first and second terminals are mounted through the base respectively on the first and second tongue. The second tongue includes pairs of high frequency signal transmission terminals each having a transverse extension section and a soldering section formed on the transverse extension section. The transverse extension sections of each pair protrude reversely and oppositely to increase the distance between the soldering sections therefore to prevent crosstalk between the high frequency signal transmission terminals.
Public/Granted literature
- US1238565A Speed-changing, reversing, and braking gearing. Public/Granted day:1917-08-28
Information query