Invention Grant
- Patent Title: Connector and a method of manufacturing the same
- Patent Title (中): 连接器及其制造方法
-
Application No.: US12346753Application Date: 2008-12-30
-
Publication No.: US08011973B2Publication Date: 2011-09-06
- Inventor: Jiang Feng , Wang Zhenbo , Zhang Zifeng , Wang Kun , Huang Zhixue
- Applicant: Jiang Feng , Wang Zhenbo , Zhang Zifeng , Wang Kun , Huang Zhixue
- Applicant Address: CN Shenzhen
- Assignee: BYD Company Ltd.
- Current Assignee: BYD Company Ltd.
- Current Assignee Address: CN Shenzhen
- Agency: Morgan, Lewis & Bockius LLP
- Priority: CN200820095657U 20080718; CN200810142658 20080725; CN200820095923U 20080725
- Main IPC: H01R24/00
- IPC: H01R24/00

Abstract:
The invention discloses a connector that comprises an insulation body and one or more conductive terminals within the insulation body. The one or more conductive terminals comprise at least one clamping portion to clamp onto the insulation body. The invention further discloses an endoscope, which comprises a telescope, an imaging means, an image sensor that transforms optical signals from the imaging means into electrical signals and a PCB board that organizes and outputs the electrical signals, the imaging means, image sensor and PCB board being located in the telescope, wherein the endoscope further comprises the connector that electrically connects the image sensor and the PCB board to form a first assembly. The invention further discloses a method to make the connector.
Public/Granted literature
- US20100015857A1 Connector and a Method of Manufacturing the Same Public/Granted day:2010-01-21
Information query