Invention Grant
- Patent Title: Polishing pad, method for manufacturing the polishing pad
- Patent Title (中): 抛光垫，抛光垫的制造方法
-
Application No.: US11774779Application Date: 2007-07-09
-
Publication No.: US08011999B2Publication Date: 2011-09-06
- Inventor: Hiromasa Nagase , Akio Yokofuke , Hiroshi Misawa
- Applicant: Hiromasa Nagase , Akio Yokofuke , Hiroshi Misawa
- Applicant Address: JP Yokohama
- Assignee: Fujitsu Semiconductor Limited
- Current Assignee: Fujitsu Semiconductor Limited
- Current Assignee Address: JP Yokohama
- Agency: Westerman, Hattori, Daniels & Adrian, LLP
- Priority: JP2006-189424 20060710
- Main IPC: B24D11/00
- IPC: B24D11/00
Abstract:
A polishing pad with first plural concave portions regularly allocated with prescribed spacing or/and a groove formed on the surface of the polishing pad; and a second concave portion randomly allocated without corresponding to the first plural concave portions or/and the groove formed on the surface of the polishing pad.
Public/Granted literature
- US20080009228A1 POLISHING PAD, METHOD FOR MANUFACTURING THE POLISHING PAD, AND METHOD FOR POLISHING AN OBJECT Public/Granted day:2008-01-10
Information query
