Invention Grant
- Patent Title: Method and apparatus for controlling diameter of a silicon crystal ingot in a growth process
- Patent Title (中): 在生长过程中控制硅晶锭的直径的方法和装置
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Application No.: US12184016Application Date: 2008-07-31
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Publication No.: US08012255B2Publication Date: 2011-09-06
- Inventor: Benno Orschel , Joel Kearns , Keiichi Takanashi , Volker Todt
- Applicant: Benno Orschel , Joel Kearns , Keiichi Takanashi , Volker Todt
- Applicant Address: US AZ Phoenix JP Tokyo
- Assignee: Sumco Phoenix Corporation,Sumco Corporation
- Current Assignee: Sumco Phoenix Corporation,Sumco Corporation
- Current Assignee Address: US AZ Phoenix JP Tokyo
- Agency: Brinks Hofer Gilson & Lione
- Main IPC: C30B15/22
- IPC: C30B15/22

Abstract:
An improvement to a method and an apparatus for growing a monocrystalline silicon ingot from silicon melt according to the CZ process. The improvement performs defining an error between a target taper of a meniscus and a measured taper, and translating the taper error into a feedback adjustment to a pull-speed of the silicon ingot. The conventional control model for controlling the CZ process relies on linear control (PID) controlling a non-linear system of quadratic relationship defined in the time domain between the diameter and the pull-speed. The present invention transforms the quadratic relationship in the time domain between the diameter and the pull-speed into a simile, linear relationship in the length domain between a meniscus taper of the ingot and the pull-speed. The present invention applies a linear control (modified PID) which operates in the length domain, and controls a system that has a linear relationship between the ingot taper and the pull-speed in the length domain to control the diameter of a growing silicon ingot.
Public/Granted literature
- US20100024716A1 METHOD AND APPARATUS FOR CONTROLLING DIAMETER OF A SILICON CRYSTAL INGOT IN A GROWTH PROCESS Public/Granted day:2010-02-04
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