Invention Grant
- Patent Title: ALD apparatus and method
- Patent Title (中): ALD装置和方法
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Application No.: US12613722Application Date: 2009-11-06
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Publication No.: US08012261B2Publication Date: 2011-09-06
- Inventor: Ofer Sneh
- Applicant: Ofer Sneh
- Applicant Address: US CO Broomfield
- Assignee: Sundew Technologies, LLC
- Current Assignee: Sundew Technologies, LLC
- Current Assignee Address: US CO Broomfield
- Agency: Patton Boggs LLP
- Main IPC: C23C16/00
- IPC: C23C16/00
Abstract:
An apparatus and method for atomic layer deposition with improved efficiency of both chemical dose and purge is presented. The apparatus includes an integrated equipment and procedure for chamber maintenance.
Public/Granted literature
- US20100043888A1 ALD APPARATUS AND METHOD Public/Granted day:2010-02-25
Information query
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