Invention Grant
US08012266B2 System and method for scrubbing CMP slurry systems 失效
用于擦洗CMP浆料系统的系统和方法

System and method for scrubbing CMP slurry systems
Abstract:
A system and apparatus for cleaning particle deposits from slurry distribution system components by injecting gas bubbles into the slurry solution having a geometry and interval such that an optimal cleaning power and cleaning rate is obtained. The method provides efficient cleaning of the buildup of abrasive particles deposited from the slurry solution without requiring the operator to disassemble or flush the slurry distribution system. The system cleaning potential is optimal when the diameter of the bubbles and the fluid slug length is approximately equal to the pipe diameter.
Public/Granted literature
Information query
Patent Agency Ranking
0/0