Invention Grant
- Patent Title: System and method for scrubbing CMP slurry systems
- Patent Title (中): 用于擦洗CMP浆料系统的系统和方法
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Application No.: US11639884Application Date: 2006-12-15
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Publication No.: US08012266B2Publication Date: 2011-09-06
- Inventor: John W. Janzen , Daniel K. Casey
- Applicant: John W. Janzen , Daniel K. Casey
- Applicant Address: US NJ Morristown
- Assignee: Honeywell International Inc.
- Current Assignee: Honeywell International Inc.
- Current Assignee Address: US NJ Morristown
- Agency: Shumaker & Sieffert, P.A.
- Main IPC: B08B9/032
- IPC: B08B9/032

Abstract:
A system and apparatus for cleaning particle deposits from slurry distribution system components by injecting gas bubbles into the slurry solution having a geometry and interval such that an optimal cleaning power and cleaning rate is obtained. The method provides efficient cleaning of the buildup of abrasive particles deposited from the slurry solution without requiring the operator to disassemble or flush the slurry distribution system. The system cleaning potential is optimal when the diameter of the bubbles and the fluid slug length is approximately equal to the pipe diameter.
Public/Granted literature
- US20080142040A1 System and method for scrubbing CMP slurry systems Public/Granted day:2008-06-19
Information query
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