This invention is directed to alkylphenol ethoxylate (APE)-free polymer binders formed by aqueous free radical emulsion polymerization and having specific peel and cure properties. The APE-free polymeric binders have a peel value, when adhered to a heated metal surface, of 35% to 200% of the peel value shown by a standard APE-based polymer binder control and exhibit a cure profile such that at least 55% cure is achieved within 30 seconds at a temperature required for cure, and a wet tensile strength at 30-seconds of cure of at least 1000 g/5 cm. Wet tensile strength is used as a measure of cure. Binders having the peel and cure properties described herein can be considered for use in crepe processes, especially DRC processes.