Invention Grant
- Patent Title: Multilayer adhesive for thermal reversible joining of substrates
- Patent Title (中): 用于热可逆接合基板的多层粘合剂
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Application No.: US11867558Application Date: 2007-10-04
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Publication No.: US08012292B2Publication Date: 2011-09-06
- Inventor: Tao Xie , Xingcheng Xiao , Ruomiao Wang , Hamid G. Kia , Jessica A. Schroeder , Todd E. Durocher
- Applicant: Tao Xie , Xingcheng Xiao , Ruomiao Wang , Hamid G. Kia , Jessica A. Schroeder , Todd E. Durocher
- Applicant Address: US MI Detroit
- Assignee: GM Global Technology Operations LLC
- Current Assignee: GM Global Technology Operations LLC
- Current Assignee Address: US MI Detroit
- Agency: Reising Ethington P.C.
- Main IPC: B32B3/20
- IPC: B32B3/20 ; B32B1/00 ; B32B7/12 ; C09J5/06
Abstract:
One embodiment of the invention includes a multilayer dry adhesive system capable of reversible joining of rigid substrates.
Public/Granted literature
- US20080292848A1 MULTILAYER ADHESIVE FOR THERMAL REVERSIBLE JOINING OF SUBSTRATES Public/Granted day:2008-11-27
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