Invention Grant
- Patent Title: Lanthanoid aluminate film fabrication method
- Patent Title (中): 镧系铝酸盐薄膜的制造方法
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Application No.: US11966304Application Date: 2007-12-28
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Publication No.: US08012315B2Publication Date: 2011-09-06
- Inventor: Tsunehiro Ino , Akira Takashima
- Applicant: Tsunehiro Ino , Akira Takashima
- Applicant Address: JP Tokyo
- Assignee: Kabushiki Kaisha Toshiba
- Current Assignee: Kabushiki Kaisha Toshiba
- Current Assignee Address: JP Tokyo
- Agency: Oblon, Spivak, McClelland, Maier & Neustadt, L.L.P.
- Priority: JP2007-115459 20070425
- Main IPC: C23C14/35
- IPC: C23C14/35

Abstract:
A method of fabricating by co-sputtering deposition a lanthanoid aluminate film with enhanced electrical insulativity owing to suppression of deviation in composition of the film is disclosed. Firstly within a vacuum chamber, hold two separate targets, one of which is made of lanthanoid aluminate (LnAlO3) and the other of which is made of aluminum oxide (Al2O3). Then, transport and load a substrate into the vacuum chamber. Next, introduce a chosen sputtering gas into this chamber. Thereafter, perform sputtering of both the targets at a time to thereby form a lanthanoid aluminate film on the substrate surface. This film is well adaptable for use as ultra-thin high dielectric constant (high-k) gate dielectrics in highly miniaturized metal oxide semiconductor (MOS) transistors.
Public/Granted literature
- US20080271990A1 LANTHANOID ALUMINATE FILM FABRICATION METHOD Public/Granted day:2008-11-06
Information query
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