Invention Grant
- Patent Title: Metal plating compositions and methods
- Patent Title (中): 金属电镀组合物和方法
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Application No.: US12080522Application Date: 2008-04-02
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Publication No.: US08012334B2Publication Date: 2011-09-06
- Inventor: Erik Reddington , Gonzalo Urrutia Desmaison , Zukhra I. Niazimbetova , Donald E. Cleary , Mark Lefebvre
- Applicant: Erik Reddington , Gonzalo Urrutia Desmaison , Zukhra I. Niazimbetova , Donald E. Cleary , Mark Lefebvre
- Applicant Address: US MA Marlborough
- Assignee: Rohm and Haas Electronic Materials LLC
- Current Assignee: Rohm and Haas Electronic Materials LLC
- Current Assignee Address: US MA Marlborough
- Agent John J. Piskorski
- Main IPC: C25D3/56
- IPC: C25D3/56 ; C25D3/62 ; C25D3/00 ; C25D3/46 ; C25D3/50 ; C25D3/48 ; C25D3/12 ; C25D3/26 ; C25D3/28 ; C25D3/38 ; C25D3/30 ; C23C18/40
Abstract:
Disclosed are metal plating compositions and methods. The metal plating compositions provide good leveling performance and throwing power.
Public/Granted literature
- US20080268138A1 Metal plating compositions and methods Public/Granted day:2008-10-30
Information query
