Invention Grant
- Patent Title: Film forming method, film forming apparatus, method of manufacturing device, and apparatus for manufacturing device
- Patent Title (中): 成膜方法，成膜装置，制造装置的方法以及装置的制造装置
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Application No.: US11588240Application Date: 2006-10-27
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Publication No.: US08012545B2Publication Date: 2011-09-06
- Inventor: Minoru Koyama
- Applicant: Minoru Koyama
- Applicant Address: JP Tokyo
- Assignee: Seiko Epson Corporation
- Current Assignee: Seiko Epson Corporation
- Current Assignee Address: JP Tokyo
- Agency: Oliff & Berridge, PLC
- Priority: JP2002-246925 20020827
- Main IPC: B05D5/00
- IPC: B05D5/00 ; B05D5/12
Abstract:
The invention provides a film forming method that improves throughput in a preliminary discharge. The film forming method according to the present invention can include a preliminary discharge step of preliminarily discharging liquid droplets from a head and a liquid droplet discharge step of relatively moving the head and the work to discharge the liquid droplets onto the surface of the work from the head. The preliminary discharge of the liquid droplets is carried out while the head and the work are moved relative to each other.
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