Invention Grant
- Patent Title: Adhesive bonding sheet, semiconductor device using the same, and method for manufacturing such semiconductor device
- Patent Title (中): 粘合粘合片，使用其的半导体装置及其制造方法
-
Application No.: US12534253Application Date: 2009-08-03
-
Publication No.: US08012580B2Publication Date: 2011-09-06
- Inventor: Keisuke Ookubo , Teiichi Inada
- Applicant: Keisuke Ookubo , Teiichi Inada
- Applicant Address: JP Tokyo
- Assignee: Hitachi Chemical Company, Ltd.
- Current Assignee: Hitachi Chemical Company, Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Antonelli, Terry, Stout & Kraus, LLP.
- Priority: JPP2004-147973 20040518
- Main IPC: H01L21/301
- IPC: H01L21/301
Abstract:
An adhesive bonding sheet having an optically transmitting supporting substrate and an adhesive bonding layer, and being used in both a dicing step and a semiconductor element adhesion step, wherein the adhesive bonding layer comprises: a polymer component (A) having a weight average molecular weight of 100,000 or more including functional groups; an epoxy resin (B); a phenolic epoxy resin curing agent (C); a photoreactive monomer (D), wherein the Tg of the cured material obtained by ultraviolet light irradiation is 250° C. or more; and a photoinitiator (E) which generates a base and a radical by irradiation with ultraviolet light of wavelength 200-450 nm.
Public/Granted literature
Information query
IPC分类:
