Invention Grant
- Patent Title: Method of patterning target layer on substrate
- Patent Title (中): 在基板上图案化目标层的方法
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Application No.: US12212939Application Date: 2008-09-18
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Publication No.: US08012675B2Publication Date: 2011-09-06
- Inventor: Chin-Cheng Yang
- Applicant: Chin-Cheng Yang
- Applicant Address: TW Hsinchu
- Assignee: MACRONIX International Co., Ltd.
- Current Assignee: MACRONIX International Co., Ltd.
- Current Assignee Address: TW Hsinchu
- Agency: J.C. Patents
- Main IPC: G03F7/20
- IPC: G03F7/20

Abstract:
A method of patterning a target layer on a substrate is described. A patterned photoresist layer is formed over the target layer, wherein the patterned photoresist layer has unexposed parts as separate islands and each unexposed part has a low proton concentration at least in its sidewalls. Acid-crosslinked polymer layers are formed only on the sidewalls of each unexposed part. A flood exposure step is performed to the substrate. A baking step is performed to the patterned photoresist layer. A development step is performed to remove the previously unexposed parts. The target layer is etched with the acid-crosslinked polymer layers as a mask.
Public/Granted literature
- US20100068657A1 METHOD OF PATTERNING TARGET LAYER ON SUBSTRATE Public/Granted day:2010-03-18
Information query
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