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US08012675B2 Method of patterning target layer on substrate 有权
在基板上图案化目标层的方法

Method of patterning target layer on substrate
Abstract:
A method of patterning a target layer on a substrate is described. A patterned photoresist layer is formed over the target layer, wherein the patterned photoresist layer has unexposed parts as separate islands and each unexposed part has a low proton concentration at least in its sidewalls. Acid-crosslinked polymer layers are formed only on the sidewalls of each unexposed part. A flood exposure step is performed to the substrate. A baking step is performed to the patterned photoresist layer. A development step is performed to remove the previously unexposed parts. The target layer is etched with the acid-crosslinked polymer layers as a mask.
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