Invention Grant
- Patent Title: Process for preparing conductive material
- Patent Title (中): 制备导电材料的方法
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Application No.: US12305929Application Date: 2007-06-22
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Publication No.: US08012676B2Publication Date: 2011-09-06
- Inventor: Takenobu Yoshiki , Shigeki Shino , Kazuhisa Kobayashi
- Applicant: Takenobu Yoshiki , Shigeki Shino , Kazuhisa Kobayashi
- Applicant Address: JP Tokyo
- Assignee: Mitsubishi Paper Mills Limited
- Current Assignee: Mitsubishi Paper Mills Limited
- Current Assignee Address: JP Tokyo
- Agency: Birch, Stewart, Kolasch & Birch, LLP
- Priority: JP2006-172529 20060622; JP2006-176037 20060627; JP2007-077438 20070323
- International Application: PCT/JP2007/062561 WO 20070622
- International Announcement: WO2007/148773 WO 20071227
- Main IPC: G03C1/00
- IPC: G03C1/00 ; G03C1/005 ; G03C5/26 ; G03C1/06 ; G03F7/00

Abstract:
It is to provide a process for preparing a conductive material in which transparency and conductivity are both high, and storage stability is high, and further, in a process for preparing a conductive material utilizing ultra fine silver particles, to provide a process for preparing a conductive material having high conductivity without requiring a calcination step which has conventionally been required.A process for preparing a conductive material having a conductive pattern containing silver on a support, which process for preparing a conductive material comprises acting at least one of the following mentioned (I) to (IV) on the pattern portion containing silver provided on the support:(I) a reducing substance,(II) a water-soluble phosphorus oxo acid compound,(III) a water-soluble halogen compound,(IV) warm water of 55° C. or higher.
Public/Granted literature
- US20090233237A1 Process For Preparing Conductive Material Public/Granted day:2009-09-17
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