Invention Grant
- Patent Title: Water quality evaluation method and substrate contacting apparatus used
- Patent Title (中): 使用水质评价方法和底物接触装置
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Application No.: US11840726Application Date: 2007-08-17
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Publication No.: US08012755B2Publication Date: 2011-09-06
- Inventor: Takeo Fukui , Ikunori Yokoi , Tetsuo Mizuniwa
- Applicant: Takeo Fukui , Ikunori Yokoi , Tetsuo Mizuniwa
- Applicant Address: JP Tokyo
- Assignee: Kurita Water Industries Ltd.
- Current Assignee: Kurita Water Industries Ltd.
- Current Assignee Address: JP Tokyo
- Agency: J.C. Patents
- Priority: JP2006-224401 20060821
- Main IPC: G01N33/18
- IPC: G01N33/18 ; G01N33/20

Abstract:
A water quality evaluation method capable of evaluating quality of water to be evaluated with high precision and a substrate contacting apparatus used in the water quality evaluation method are provided. The substrate contacting apparatus 10 has a sealing performance keeping the interior at a vacuum degree lower than or equal to −0.094 MPa. A substrate W is accommodated in the substrate contacting apparatus 10 and water to be evaluated is fed therein, after stopping feeding water, the interior of the substrate contacting apparatus 10 is sealed, and the substrate contacting apparatus 10 is sent to an analysis device with the substrate W accommodated therein.
Public/Granted literature
- US20080044924A1 WATER QUALITY EVALUATION METHOD AND SUBSTRATE CONTACTING APPARATUS USED Public/Granted day:2008-02-21
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