Invention Grant
- Patent Title: Pipette tip loading assembly
- Patent Title (中): 移液器吸头装载组件
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Application No.: US11500174Application Date: 2006-08-07
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Publication No.: US08012767B2Publication Date: 2011-09-06
- Inventor: Brian Rasnow , Chuck Z. Li , Stephen Robert Wilson
- Applicant: Brian Rasnow , Chuck Z. Li , Stephen Robert Wilson
- Applicant Address: US CA Thousand Oaks
- Assignee: Amgen Inc.
- Current Assignee: Amgen Inc.
- Current Assignee Address: US CA Thousand Oaks
- Agency: Vierra Magen Marcus & DeNiro LLP
- Main IPC: G01N1/10
- IPC: G01N1/10 ; B01L3/02

Abstract:
A method of loading a plurality of pipette tips on a plurality of mandrels of a pipetter is provided. A plurality of pipette tips are inserted in a plurality of receptacles of a tip loading assembly. The plurality of pipette tips are oriented with respect to each other by a plate. The tip loading assembly includes, but is not limited to, an insertion surface. The insertion surface includes the plurality of receptacles configured to accept the plurality of pipette tips. A receptacle from among the plurality of receptacles includes a receptacle wall and a beveled surface that extends from at least a portion of the insertion surface. A retention force is applied to the plate. The plurality of pipette tips are attached to a plurality of mandrels of a pipetter and are separated from the plate.
Public/Granted literature
- US20080031781A1 Pipette tip loading assembly Public/Granted day:2008-02-07
Information query