Invention Grant
- Patent Title: Apparatus and methods for constructing semiconductor chip packages with silicon space transformer carriers
- Patent Title (中): 用硅空间变压器承载构造半导体芯片封装的装置和方法
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Application No.: US12538223Application Date: 2009-08-10
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Publication No.: US08012796B2Publication Date: 2011-09-06
- Inventor: Paul S. Andry , John M. Cotte , John U. Knickerbocker , Cornelia K. Tsang
- Applicant: Paul S. Andry , John M. Cotte , John U. Knickerbocker , Cornelia K. Tsang
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Main IPC: H01L21/00
- IPC: H01L21/00
Abstract:
Apparatus and methods are provided for high density packaging of semiconductor chips using silicon space transformer chip level package structures, which allow high density chip interconnection and/or integration of multiple chips or chip stacks high I/O interconnection and heterogeneous chip or function integration.
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