Invention Grant
US08012807B2 Method for producing chip packages, and chip package produced in this way
有权
制造芯片封装的方法，以及以这种方式制造的芯片封装
- Patent Title: Method for producing chip packages, and chip package produced in this way
- Patent Title (中): 制造芯片封装的方法，以及以这种方式制造的芯片封装
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Application No.: US11776976Application Date: 2007-07-12
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Publication No.: US08012807B2Publication Date: 2011-09-06
- Inventor: Thorsten Meyer , Harry Hedler , Markus Brunnbauer
- Applicant: Thorsten Meyer , Harry Hedler , Markus Brunnbauer
- Applicant Address: DE Neubiberg
- Assignee: Infineon Technologies AG
- Current Assignee: Infineon Technologies AG
- Current Assignee Address: DE Neubiberg
- Agency: Dicke, Billig & Czaja, PLLC
- Priority: DE102006032251 20060712
- Main IPC: H01L21/56
- IPC: H01L21/56 ; H01L23/48
Abstract:
A method for producing chip packages is disclosed. In one embodiment, a plurality of chips is provided. The chips each have first pads. Second connection pads are applied on the wafer, wherein each second pad is electrically connected to a first pad.
Public/Granted literature
- US20080012144A1 METHOD FOR PRODUCING CHIP PACKAGES, AND CHIP PACKAGE PRODUCED IN THIS WAY Public/Granted day:2008-01-17
Information query
IPC分类:
