Invention Grant
US08012839B2 Method for fabricating a semiconductor device having an epitaxial channel and transistor having same
有权
用于制造具有外延沟道的半导体器件的方法和具有其的晶体管
- Patent Title: Method for fabricating a semiconductor device having an epitaxial channel and transistor having same
- Patent Title (中): 用于制造具有外延沟道的半导体器件的方法和具有其的晶体管
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Application No.: US12040562Application Date: 2008-02-29
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Publication No.: US08012839B2Publication Date: 2011-09-06
- Inventor: Jinping Liu , Alex K H See , Mei Sheng Zhou , Liang Choo Hsia
- Applicant: Jinping Liu , Alex K H See , Mei Sheng Zhou , Liang Choo Hsia
- Applicant Address: SG Singapore
- Assignee: Chartered Semiconductor Manufacturing, Ltd.
- Current Assignee: Chartered Semiconductor Manufacturing, Ltd.
- Current Assignee Address: SG Singapore
- Agency: Brinks Hofer Gilson & Lione
- Main IPC: H01L21/336
- IPC: H01L21/336

Abstract:
A transistor having an epitaxial channel and a method for fabricating a semiconductor device having an epitaxial channel, the method including forming a hardmask on a substrate and forming an opening in the hardmask. The opening is geometrically characterized by a long dimension and a short dimension, and the opening is arranged in a predetermined manner relative to the channel region of a transistor. An epitaxial material is formed in the opening that induces strain in substrate regions proximate to the epitaxial material. The epitaxial material is confined to the opening, such that an epitaxial channel is formed. A transistor is fabricated in proximity to the epitaxial channel, such that the strain induced in the substrate provides enhanced transistor performance. By confining the epitaxial material to a predefined channel in the substrate, plastic strain relaxation of the epitaxial material is minimized and a maximum amount of strain is induced in the substrate.
Public/Granted literature
- US20090218597A1 METHOD FOR FABRICATING A SEMICONDUCTOR DEVICE HAVING AN EPITAXIAL CHANNEL AND TRANSISTOR HAVING SAME Public/Granted day:2009-09-03
Information query
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