Invention Grant
US08012840B2 Semiconductor device and method of manufacturing semiconductor device 有权
半导体装置及其制造方法

  • Patent Title: Semiconductor device and method of manufacturing semiconductor device
  • Patent Title (中): 半导体装置及其制造方法
  • Application No.: US12472860
    Application Date: 2009-05-27
  • Publication No.: US08012840B2
    Publication Date: 2011-09-06
  • Inventor: Atsuhiro Ando
  • Applicant: Atsuhiro Ando
  • Applicant Address: JP Tokyo
  • Assignee: Sony Corporation
  • Current Assignee: Sony Corporation
  • Current Assignee Address: JP Tokyo
  • Agency: SNR Denton US LLP
  • Priority: JP2005-050213 20050225
  • Main IPC: H01L21/336
  • IPC: H01L21/336
Semiconductor device and method of manufacturing semiconductor device
Abstract:
A semiconductor device includes a side wall spacer formed on the side surface of a gate electrode formed on the upper side of a semiconductor substrate with a gate insulation film therebetween, extension regions built up on the semiconductor substrate, and source/drain regions formed on the extension regions, wherein a first epitaxial layer is formed so as to fill up portions, cut out at the time of forming the side wall spacer, of the semiconductor substrate, and the extension regions are formed on the first epitaxial layer from a second epitaxial layer of a conduction type opposite to that of the first epitaxial layer.
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