Invention Grant
- Patent Title: Laser annealing method and laser annealing device
- Patent Title (中): 激光退火方法和激光退火装置
-
Application No.: US12159259Application Date: 2006-11-07
-
Publication No.: US08012841B2Publication Date: 2011-09-06
- Inventor: Kenichiro Nishida , Ryusuke Kawakami , Norihito Kawaguchi , Miyuki Masaki
- Applicant: Kenichiro Nishida , Ryusuke Kawakami , Norihito Kawaguchi , Miyuki Masaki
- Applicant Address: JP Atsugi-shi, Kanagawa-ken
- Assignee: Semiconductor Energy Laboratory Co., Ltd.
- Current Assignee: Semiconductor Energy Laboratory Co., Ltd.
- Current Assignee Address: JP Atsugi-shi, Kanagawa-ken
- Agency: Fish & Richardson P.C.
- Priority: JP2006-005864 20060113; JP2006-148337 20060529
- International Application: PCT/JP2006/322144 WO 20061107
- International Announcement: WO2007/080693 WO 20070719
- Main IPC: H01L21/336
- IPC: H01L21/336

Abstract:
The energy distribution in the short-side direction of a rectangular laser beam applied to an amorphous semiconductor film (amorphous silicon film) is uniformized. It is possible to the energy distribution in the short-side direction of the rectangular laser beam by the use of a cylindrical lens array 26 or a light guide 36 and concentrating optical systems 28 and 44 or by the use of an optical system including a diffracting optical element. Accordingly, since the effective energy range of a laser beam applied to the amorphous semiconductor film is widened and the transport speed of a substrate 3 can be enhanced as much, it is possible to improve the processing ability of the laser annealing.
Public/Granted literature
- US20100221898A1 LASER ANNEALING METHOD AND LASER ANNEALING DEVICE Public/Granted day:2010-09-02
Information query
IPC分类: