Invention Grant
- Patent Title: Method of bonding semiconductor devices utilizing solder balls
- Patent Title (中): 使用焊球接合半导体器件的方法
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Application No.: US12130386Application Date: 2008-05-30
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Publication No.: US08012866B2Publication Date: 2011-09-06
- Inventor: Ping Liang Tu , Chun Hung Samuel Ip
- Applicant: Ping Liang Tu , Chun Hung Samuel Ip
- Applicant Address: HK Hong Kong
- Assignee: ASM Assembly Automation Ltd
- Current Assignee: ASM Assembly Automation Ltd
- Current Assignee Address: HK Hong Kong
- Agency: Ostrolenk Faber LLP
- Main IPC: H01L21/44
- IPC: H01L21/44
Abstract:
A method for bonding a semiconductor device onto a substrate is provided which comprises the steps of picking up a solder ball with a pick head, placing the solder ball onto the substrate and melting the solder ball on the substrate and placing the semiconductor device on the molten solder ball. The molten solder ball is then allowed to cool to form a solder joint which bonds the semiconductor device to the substrate.
Public/Granted literature
- US20090298278A1 METHOD OF BONDING SEMICONDUCTOR DEVICES UTILIZING SOLDER BALLS Public/Granted day:2009-12-03
Information query
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