Invention Grant
- Patent Title: Wet cleaning solution
- Patent Title (中): 湿清洗液
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Application No.: US11703752Application Date: 2007-02-08
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Publication No.: US08012922B2Publication Date: 2011-09-06
- Inventor: Cheng-Yuan Tsai , Chih-Lung Lin , Cheng-Chen Hsueh
- Applicant: Cheng-Yuan Tsai , Chih-Lung Lin , Cheng-Chen Hsueh
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee Address: TW Hsin-Chu
- Agency: Birch, Stewart, Kolasch & Birch, LLP
- Main IPC: C11D1/88
- IPC: C11D1/88 ; C11D3/28 ; C11D3/43
Abstract:
A wet cleaning solution, comprising 0.01-3 wt % of an amphoteric imidazolium surfactant capable of forming a complex with metal ions, a pH adjuster, and balanced deionized water. The wet cleaning solution is substantially free of corrosion inhibitor other than the imidazolium amphoteric surfactant.
Public/Granted literature
- US20080194452A1 Wet cleaning solution Public/Granted day:2008-08-14
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