Invention Grant
US08013056B2 White heat-curable silicone resin composition, optoelectronic part case, and molding method
有权
白色可热固化硅树脂组合物，光电部件外壳和成型方法
- Patent Title: White heat-curable silicone resin composition, optoelectronic part case, and molding method
- Patent Title (中): 白色可热固化硅树脂组合物，光电部件外壳和成型方法
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Application No.: US12344048Application Date: 2008-12-24
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Publication No.: US08013056B2Publication Date: 2011-09-06
- Inventor: Yusuke Taguchi , Kazutoshi Tomiyoshi , Tomoyoshi Tada , Hisashi Shimizu
- Applicant: Yusuke Taguchi , Kazutoshi Tomiyoshi , Tomoyoshi Tada , Hisashi Shimizu
- Applicant Address: JP Tokyo
- Assignee: Shin-Etsu Chemical Co., Ltd.
- Current Assignee: Shin-Etsu Chemical Co., Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Birch, Stewart, Kolasch & Birch, LLP
- Priority: JP2007-333738 20071226
- Main IPC: C08L83/06
- IPC: C08L83/06 ; B29D11/00
Abstract:
A silicone resin composition comprising (A) a heat-curable organopolysiloxane having a melting point of 40-130° C., (B) a white pigment, (C) an inorganic filler, and (D) a curing catalyst is transfer or compression moldable at elevated temperatures into a cured product having white color, heat resistance, light resistance and minimal yellowing. The cured product is suited as a case in which an optoelectronic part is enclosed.
Public/Granted literature
- US20090171013A1 WHITE HEAT-CURABLE SILICONE RESIN COMPOSITION, OPTOELECTRONIC PART CASE, AND MOLDING METHOD Public/Granted day:2009-07-02
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