Invention Grant
US08013058B2 Composition having improved adherence with an addition-curable material and composite article incorporating the composition
失效
具有改善与可加成固化材料的粘合性和掺入该组合物的复合制品的组合物
- Patent Title: Composition having improved adherence with an addition-curable material and composite article incorporating the composition
- Patent Title (中): 具有改善与可加成固化材料的粘合性和掺入该组合物的复合制品的组合物
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Application No.: US12945477Application Date: 2010-11-12
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Publication No.: US08013058B2Publication Date: 2011-09-06
- Inventor: Dongchan Ahn , Nick Evan Shepard , Harold Christian Fowler , Kevin Louis Nichols , John Matthew Warakomski
- Applicant: Dongchan Ahn , Nick Evan Shepard , Harold Christian Fowler , Kevin Louis Nichols , John Matthew Warakomski
- Applicant Address: US MI Midland
- Assignee: Dow Corning Corporation
- Current Assignee: Dow Corning Corporation
- Current Assignee Address: US MI Midland
- Agency: Howard & Howard Attorneys PLLC
- Main IPC: C08L83/00
- IPC: C08L83/00 ; C08L83/04 ; B32B9/04

Abstract:
A composition and composite article have improved adherence with an addition-curable material. The composition and therefore the composite article, which includes at least one substrate formed from the composition, include a resin and an additive that is incorporated into the resin. The resin is organic and polymeric and free of ethylenically unsaturated and silicon hydride functional groups. The additive is selected from the group of a fluorine-substituted organopolysiloxane, an amino-functional organopolysiloxane, an unsaturated carboxylic acid or carboxylic acid salt, and combinations thereof. Further, the additive includes a hydrosilylation reactive group present at a surface of the substrate for reaction with the addition-curable material. This improves adherence of the substrate with the addition-curable material. The substrate and the addition-curable material bond together to make the composition article.
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