Invention Grant
- Patent Title: Curable composition
- Patent Title (中): 可固化组合物
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Application No.: US10545807Application Date: 2004-02-17
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Publication No.: US08013075B2Publication Date: 2011-09-06
- Inventor: Kei Hirata , Koji Kitayama , Mizuho Maeda
- Applicant: Kei Hirata , Koji Kitayama , Mizuho Maeda
- Applicant Address: JP Kurashiki-shi
- Assignee: Kuraray Co., Ltd.
- Current Assignee: Kuraray Co., Ltd.
- Current Assignee Address: JP Kurashiki-shi
- Agency: Oblon, Spivak, McClelland, Maier & Neustadt, L.L.P.
- Priority: JP2003-054354 20030228; JP2003-107892 20030411
- International Application: PCT/JP2004/001708 WO 20040217
- International Announcement: WO2004/076558 WO 20040910
- Main IPC: C08C19/00
- IPC: C08C19/00 ; C08L63/00 ; C08L37/00

Abstract:
A curable composition includes (A) a (meth)acrylate, (B) a radical polymerization initiator, (C) an epoxidized polyisoprene containing an epoxy group at 0.15 to 2.5 meq/g in the molecule and having a number-average molecular weight of 15000 to 200000, and (D) a curing accelerator. The curable composition shows high elongation and excellent rubber elasticity even in a cured state and has superior compatibility, transparency, waterproofness and flexibility, so that cracks and separation of cured products are reduced. Accordingly, the composition is suitable for use as adhesives, coating agents, encapsulating materials, inks, sealing materials and the like.
Public/Granted literature
- US20060194923A1 Curable composition Public/Granted day:2006-08-31
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