Invention Grant
- Patent Title: Shield conductor and shield conductor manufacturing method
- Patent Title (中): 屏蔽导体和屏蔽导体制造方法
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Application No.: US12312466Application Date: 2007-11-23
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Publication No.: US08013249B2Publication Date: 2011-09-06
- Inventor: Kunihiko Watanabe , Hideo Miyaki , Katsutoshi Izawa
- Applicant: Kunihiko Watanabe , Hideo Miyaki , Katsutoshi Izawa
- Applicant Address: JP Mie JP Mie JP Osaka
- Assignee: Autonetworks Technologies, Ltd.,Sumitomo Wiring Systems, Ltd.,Sumitomo Electric Industries, Ltd.
- Current Assignee: Autonetworks Technologies, Ltd.,Sumitomo Wiring Systems, Ltd.,Sumitomo Electric Industries, Ltd.
- Current Assignee Address: JP Mie JP Mie JP Osaka
- Agency: Oliff & Berridge, PLC
- Priority: JP2006-317667 20061124; JP2007-242545 20070919; JP2007-290985 20071108
- International Application: PCT/JP2007/072697 WO 20071123
- International Announcement: WO2008/062885 WO 20080529
- Main IPC: H01R9/05
- IPC: H01R9/05

Abstract:
A shield conductor Wa comprises: a metallic pipe 20, a wire 10 to be inserted into the pipe 20, and a groove-like fitting member 22 provided in the pipe 20 as extending along the direction of axis of the wire 10, and at the same time, attached tightly to the circumference of the wire. With the inner surface of the groove-like fitting member 22 in the pipe 20 attached tightly to the circumference of the wire 10, the heat generated in the wire 10 is transmitted directly to the pipe 20, and then released to the air from the circumference of the pipe 20. This improves radiation performance of the shield conductor Wa.
Public/Granted literature
- US20090294149A1 SHIELD CONDUCTOR AND SHIELD CONDUCTOR MANUFACTURING METHOD Public/Granted day:2009-12-03
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