Invention Grant
- Patent Title: Printed circuit board
- Patent Title (中): 印刷电路板
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Application No.: US12866981Application Date: 2008-11-21
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Publication No.: US08013254B2Publication Date: 2011-09-06
- Inventor: Yong Goo Lee , Kyoung il Kang
- Applicant: Yong Goo Lee , Kyoung il Kang
- Applicant Address: KR Gyeonggi-do
- Assignee: Gigalane Co. Ltd.
- Current Assignee: Gigalane Co. Ltd.
- Current Assignee Address: KR Gyeonggi-do
- Agency: Harness, Dickey & Pierce, P.L.C.
- Agent Anthony G. Fussner; Kisuk Lee
- Priority: KR10-2008-0014110 20080215; KR10-2008-0014163 20080215
- International Application: PCT/KR2008/006897 WO 20081121
- International Announcement: WO2009/102108 WO 20090820
- Main IPC: H05K1/00
- IPC: H05K1/00

Abstract:
The present disclosure provides a printed circuit board (PCB) comprising a first ground layer extended in one direction a first dielectric layer laminated on the first ground layer and extended in the same direction as that of the first ground layer; a signal transmission line laminated on the first dielectric layer and extended in the same direction as that of the first dielectric layer; and a plurality of first ground patterns formed by etching a surface of the first ground layer in an axial direction thereof at a predetermined interval in a line, wherein the plurality of first ground patterns expose the first dielectric layer.
Public/Granted literature
- US20100314159A1 PRINTED CIRCUIT BOARD Public/Granted day:2010-12-16
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