Invention Grant
- Patent Title: Review method and review device
- Patent Title (中): 审查方法和审查装置
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Application No.: US12366179Application Date: 2009-02-05
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Publication No.: US08013299B2Publication Date: 2011-09-06
- Inventor: Kenji Obara , Takehiro Hirai , Kohei Yamaguchi , Naoma Ban
- Applicant: Kenji Obara , Takehiro Hirai , Kohei Yamaguchi , Naoma Ban
- Applicant Address: JP Tokyo
- Assignee: Hitachi High-Technologies Corporation
- Current Assignee: Hitachi High-Technologies Corporation
- Current Assignee Address: JP Tokyo
- Agency: McDermott Will & Emery LLP
- Priority: JP2008-035444 20080218
- Main IPC: G01N23/00
- IPC: G01N23/00

Abstract:
A defect review method and a defect review device using an electron microscope, reduce the number of user processes necessary to set automatic focal adjustment of an electron beam to provide easier sample observation.The review method comprises the steps of: performing focal adjustment for a plurality of coordinate positions pre-registered on the coordinate on an object under observation; creating a criterion for focal adjustment based on a focal position at each of the plurality of coordinate positions; setting a focal probe range based on a deviation between the criterion and the focal position; and determining an automatic focal adjustment range for defect detection on the object under observation based on the set focal probe range.
Public/Granted literature
- US20090206259A1 REVIEW METHOD AND REVIEW DEVICE Public/Granted day:2009-08-20
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