Invention Grant
- Patent Title: Light emitting device and method of manufacturing the same
- Patent Title (中): 发光元件及其制造方法
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Application No.: US12555094Application Date: 2009-09-08
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Publication No.: US08013346B2Publication Date: 2011-09-06
- Inventor: Shunpei Yamazaki , Jun Koyama , Mai Osada
- Applicant: Shunpei Yamazaki , Jun Koyama , Mai Osada
- Applicant Address: JP Atsugi-shi, Kanagawa-ken
- Assignee: Semiconductor Energy Laboratory Co., Ltd.
- Current Assignee: Semiconductor Energy Laboratory Co., Ltd.
- Current Assignee Address: JP Atsugi-shi, Kanagawa-ken
- Agency: Fish & Richardson P.C.
- Priority: JP2000-388378 20001221
- Main IPC: H01L27/15
- IPC: H01L27/15

Abstract:
There is provided a light emitting device in which low power consumption can be realized even in the case of a large screen. The surface of a source signal line or a power supply line in a pixel portion is plated to reduce a resistance of a wiring. The source signal line in the pixel portion is manufactured by a step different from a source signal line in a driver circuit portion. The power supply line in the pixel portion is manufactured by a step different from a power supply line led on a substrate. A terminal is similarly plated to made the resistance reduction. It is desirable that a wiring before plating is made of the same material as a gate electrode and the surface of the wiring is plated to form the source signal line or the power supply line.
Public/Granted literature
- US20090321753A1 Light Emitting Device and Method of Manufacturing the Same Public/Granted day:2009-12-31
Information query
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