A method of manufacturing a light emitting device includes: forming a plurality of independent light emitting portions on a growth substrate; separating the light emitting portions from the growth substrate; mounting the light emitting portions onto a receiving substrate; and dicing the receiving substrate, onto which the light emitting portions are mounted, into a light emitting unit. Residual stress, which occurs when the light emitting portions are separated from the substrate, can be reduced, and the light emitting portions can be mounted onto the receiving substrate in a fluid state, whereby the light emitting device can be easily mass produced with excellent quality, and its manufacturing costs can be reduced.