Invention Grant
- Patent Title: Semiconductor device
- Patent Title (中): 半导体器件
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Application No.: US12360941Application Date: 2009-01-28
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Publication No.: US08013381B2Publication Date: 2011-09-06
- Inventor: Norio Magome , Toshifumi Minami , Tomoaki Hatano , Norihisa Arai
- Applicant: Norio Magome , Toshifumi Minami , Tomoaki Hatano , Norihisa Arai
- Applicant Address: JP Tokyo
- Assignee: Kabushiki Kaisha Toshiba
- Current Assignee: Kabushiki Kaisha Toshiba
- Current Assignee Address: JP Tokyo
- Agency: Oblon, Spivak, McClelland, Maier & Neustadt, L.L.P.
- Priority: JP2008-020632 20080131; JP2008-318453 20081215
- Main IPC: H01L29/788
- IPC: H01L29/788

Abstract:
A semiconductor device has a semiconductor substrate of a first conductivity type; first to third high-voltage insulated-gate field effect transistors formed on a principal surface of the semiconductor substrate; a first device isolation insulating film that is formed in the semiconductor substrate and isolates the first high-voltage insulated-gate field effect transistor and the second high-voltage insulated-gate field effect transistor from each other; a second device isolation insulating film that is formed in the semiconductor substrate and isolates the first high-voltage insulated-gate field effect transistor and the third high-voltage insulated-gate field effect transistor from each other; a first impurity diffusion layer of the first conductivity type that is formed below the first device isolation insulating film; and a second impurity diffusion layer of the first conductivity type that is formed below the second device isolation insulating film.
Public/Granted literature
- US20090194841A1 SEMICONDUCTOR DEVICE Public/Granted day:2009-08-06
Information query
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