Invention Grant
- Patent Title: High mobility CMOS circuits
- Patent Title (中): 高移动性CMOS电路
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Application No.: US11863757Application Date: 2007-09-28
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Publication No.: US08013392B2Publication Date: 2011-09-06
- Inventor: Bruce B. Doris , Oleg G. Gluschenkov , Huilong Zhu
- Applicant: Bruce B. Doris , Oleg G. Gluschenkov , Huilong Zhu
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agency: Roberts Mlotkowski Safran & Cole, P.C.
- Agent Joseph P. Abate
- Main IPC: H01L27/01
- IPC: H01L27/01

Abstract:
Semiconductor structure formed on a substrate and process of forming the semiconductor. The semiconductor includes a plurality of field effect transistors having a first portion of field effect transistors (FETS) and a second portion of field effect transistors. A first stress layer has a first thickness and is configured to impart a first determined stress to the first portion of the plurality of field effect transistors. A second stress layer has a second thickness and is configured to impart a second determined stress to the second portion of the plurality of field effect transistors.
Public/Granted literature
- US20080237720A1 HIGH MOBILITY CMOS CIRCUITS Public/Granted day:2008-10-02
Information query
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